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Machine Learning in EDA
报告人:余备教授、陈廷欢博士后,香港中文大学 时间:2021年9月29日(周三)20:00 字号:

报告方式:腾讯会议 (ID: 750 852 969)

邀请人:张晓岩教授

摘要:

Machine learning is a powerful technique that can derive knowledge from large data set,

and provide prediction and modeling. Since VLSI chip designs have extremely high complexity and gigantic data,

recently there has been a surge in applying and adapting machine learning to accelerate the design closure.

In this talk, we focus on some key techniques and recent developments of machine learning on chip designs.

Several case studies will be discussed on how to integrate deep learning, active learning, and graph learning techniques/engines into classical EDA design flow.


简介: Prof. Bei Yu received his Ph.D. degree  from the Department of Electrical and Computer Engineering, University of Texas  at Austin. He is currently in the Department of Computer Science and  Engineering, The Chinese University of Hong Kong. He has served in the editorial  boards of Integration, the VLSI Journal and IET Cyber-Physical Systems: Theory  & Applications. He has received four Best Paper Awards at ISPD 2017, SPIE  Advanced Lithography Conference 2016, ICCAD 2013, and ASPDAC 2012, three other  Best Paper Award Nominations at DAC 2014, ASPDAC 2013, ICCAD 2011, and four  ICCAD/ISPD contest awards.


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